Formable multilayer PCB structure: Design and technology demonstrator

Purpose: The paper aims to deal with the benefits and challenges of 3D integration of electronics and mechanics as well as the special requirements in designing a system. Design/methodology/approach: Three-dimensional integration technology has been enabled by innovations in thermoplastic printed circuit board (PCB) materials and novel system integration. Furthermore, the integration of electronics and mechanics helps manage product creation, as design phases must be integrated and teamwork well organized. A multidisciplinary approach is another must in marketing technology, because any decision to incorporate an integrative technology in a product must be based on an understanding of the many forms of expertise involved in creating a product. Findings: With a unique copper pattern for each 3D shape, inconvenient distortions can be controlled, as dedicated copper patterns enable designers to make efficient use of formable multilayer structures and advance an extra step in freedom of design. Findings are based on a working demonstrator. Research limitations/implications: Even if 3D multilayer design now lacks dedicated tools, software is likely to evolve to include all necessary functions. Practical implications: Forming a multilayer PCB enables designers to free their imagination and to take advantage of numerous possibilities, including even futuristic shapes. Originality/value: Three-dimensional integration offers great potential for product design, although by definition and in terms of production technology 3D integration is an incremental change.